Journal
APPLIED PHYSICS LETTERS
Volume 78, Issue 11, Pages 1580-1582Publisher
AMER INST PHYSICS
DOI: 10.1063/1.1356455
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Monolithically integrated active cooling is an attractive way for thermal management and temperature stabilization of microelectronic and optoelectronic devices. SiGeC can be lattice matched to Si and is a promising material for integrated coolers. SiGeC/Si superlattice structures were grown on Si substrates by molecular beam epitaxy. Thermal conductivity was measured by the 3 omega method. SiGeC/Si superlattice microcoolers with dimensions as small as 40x40 mum(2) were fabricated and characterized. Cooling by as much as 2.8 and 6.9 K was measured at 25 degreesC and 100 degreesC, respectively, corresponding to maximum spot cooling power densities on the order of 1000 W/cm(2). (C) 2001 American Institute of Physics.
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