Micromachined, flip-chip assembled, actuatable contacts for use in high density interconnection in electronics packaging

Using flip-chip assembly, micromachined contacts can be used to create a high density, actuatable electronics packaging technology. Internal residual stress is used to press bimorph beam connectors upwards against a device chip. The connectors' actuation behavior is described, including appropriate mathematical models. The electrostatically actuated beams will disconnect when driven by a 53 V signal and will reconnect when voltage falls below 43 V. Analytic models, which account for the non-linearity present in a curved cantilever beam, are presented. When switching signals, reconnection occurs in as little as 5.8 mus, disconnection occurs in as little as 4.0 mus. A microconnector's current carrying capability can be as high as 285.3 mA and its maximum power dissipation as high as 1.47 W. (C) 2001 Elsevier Science B.V. All rights reserved.