Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 30, Issue 4, Pages 309-313Publisher
MINERALS METALS MATERIALS SOC
DOI: 10.1007/s11664-001-0036-9
Keywords
ultra-low dielectric constant; poly(arylene) ethers; porous polymer film
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This paper reports the synthesis and dielectric properties of a porous poly(arylether) material with an ultra-low dielectric constant for interlayer dielectric applications in microelectronics. The porous polymer films were successfully fabricated by a method of organic phase separation and evaporation. A dielectric constant k of 1.8 was achieved for a porous film with an estimated porosity of 40% and average pore size of 3 nm. Electrical and mechanical properties as well as coefficient of thermal expansion for both dense and porous polymer films were measured.
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