HgCdTe/CdTe/Si infrared photodetectors grown by MBE for near-room temperature operation

Conventional HgCdTe infrared detectors need significant cooling in order to reduce noise and leakage currents resulting from thermal generation and recombination processes. Although the need for cooling has long been thought to be fundamental and inevitable, it has been recently suggested that Auger recombination and generation rates can be reduced by using the phenomena of exclusion and extraction to produce nonequilibrium carrier distributions. The devices with Auger suppressed operation requires precise control over the composition, and donor and acceptor doping. The successful development of the molecular beam epitaxy (MBE) growth technique for multi-layer HgCdTe makes it possible to grow these device structures. Theoretical calculations suggest that the p pin+ layer sequence is preferable for near-room temperature operation due to longer minority carrier lifetime in lightly doped p-HgCdTe absorber layers. However, because the low doping required for absorption and nonequilibrium operation is easier to achieve in n-type materials, and because Shockley-Read centers should be minimized in order to obtain the benefits of Auger suppression, we have focused on p(+)vn structures. Planar photodiodes vr ere formed on CdTe/ Si (211) composite substrates by As implantation followed by a three step annealing sequence. Three inch diameter Si substrates were employed since they are of high quality, low cost, and available in large areas. Due to this development, large area focal plane arrays (FPAs) operated at room temperature are possible in the near future. The structures were characterized by FTIR, x-ray diffraction, temperature dependent Hall measurements minority carrier lifetimes by photoconductive decay, and in-situ ellipsometry. To study the relative influence of bulk and surface effects, devices with active areas from 1.6 x 10(-5) cm(2) to 10(-3) cm(2) were fabricated. The smaller area devices show better performance in terms of reverse bias characteristics indicating that the bulk quality could be further improved. At 80 K, the zero bias leakage current for a 40 mum x 40 mum diode with 3.2 mum cutoff wavelength is 1 pA, the R(o)A product is 1.1 x 10(4) Omega -cm(2) and the breakdown voltage is in excess of 500 mV. The device shows a responsivity of 1.3 x 10(7) V/W and a 80 K detectivity of 1.9 x 10(11) cm-Hz(1/2)/W. At 200 K, the zero bias leakage current is 5 nA and the R(o)A product 2.03 Omega -cm(2), while the breakdown voltage decreases to 40 mV.