Journal
THIN SOLID FILMS
Volume 394, Issue 1-2, Pages 201-205Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/S0040-6090(01)01138-5
Keywords
flexible devices; indium; tin oxide; interfaces; optoelectronic devices
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This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. (C) 2001 Elsevier Science BY. All rights reserved.
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