Journal
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume 24, Issue 4, Pages 464-469Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/6040.982831
Keywords
lead-free solder; low-temperature liquid cooling; MCM-D; multilayer system board; multilayer thin film; packaging technology; thermosyphon; ZIF connector
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Advanced packaging technologies for CMOS based high performance Fujitsu Global Server GS8900, released in late 1999, are introduced in this paper. Extending a new standard for technological leadership among large-scale enterprise servers, the GS8900 broke the 2000 MIPS barrier in performance for the first time by taking advantages of Fujitsu advanced 0.18 mum copper wiring process and chip/MCM/system packaging capabilities, delivering a doubled performance in comparison to its predecessor. The packaging technologies are uniquely characterized in several aspects. First, the high density stacked via type MCM-D technology features four pairs of CPU tightly coupled multiprocessor and large capacity second caches, the maximum processor terminal count is more than 10000. The processors are wired onto a multilayer thin film MCM substrate with 153 mum pitch high-density area array lead-free bumps. Secondly, maximum four CPU-MCMs, including 16 CPU processors, and 64 GB main memory modules are mounted on one multilayer system board of high frequency transmission properties. Each MCM is held through a high-density ZIF connector of around 3000 I/Os in a 1.27 mm pitch full matrix, which is assembled on the system board with lead-free solders. Thirdly, advanced cooling technologies are developed for improving the system performance and reliability. For the air-cooled model, high performance thermosyphons are developed for cooling of the MCMs, resulting reduced operating temperatures and one-third of weight comparing to that of an aluminum fin heatsink. For the turbo model, a low-temperature liquid cooling system is developed, resulting more than 10% performance boost over the air-cooled model, due to significantly reduced junction temperatures. N + 1 redundancy is pro-tided for the cooling system achieving a robust design with high reliability. In addition, two kinds of new lead-free solders were developed for flip-chip and system board assemblies, respectively, which show more than ten times higher reliability than those of prior lead-tin solders.
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