Self-assembling MEMS variable and fixed RF inductors

Inductors play a key role in wireless front-end circuitry, yet are not generally well suited for conventional RF integrated-circuit (RFIC) fabrication processes. We have developed inductors that can be fabricated on a conventional RFIC silicon substrate, which use warping members to assemble themselves away from the substrate to improve quality factor (Q) and self-resonance frequency (SRF), and to provide a degree of variation in inductance value. These self-assembling variable inductors are realized through foundry provided microelectromechanical systems (MEMS) processing and have demonstrated temperature stable Q values greater than 13, SRF values well above 15 GHz, and inductance variations greater than 18%. Simulations suggest the potential for Q values above 20 and inductance variations greater than 30%, with optimized processing.