☆ 3.8 Article

Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps

IEEE TRANSACTIONS ON ADVANCED PACKAGING (2001)

Journal

IEEE TRANSACTIONS ON ADVANCED PACKAGING

Volume 24, Issue 4, Pages 569-575

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

DOI: 10.1109/6040.982846

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Categories

Engineering, Manufacturing Engineering, Electrical & Electronic Materials Science, Multidisciplinary

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