Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 10, Issue 4, Pages 503-510Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/84.967372
Keywords
complementary metal-oxide-semiconductor; (CMOS); infrared sensor array; thermal imagoing; thermoelectric sensor
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We present a micromachined 10 x 10 array of thermoelectric infrared sensors fabricated in a commercial complementary metal-oxide-semiconductor (CMOS) integrated circuit process with subsequent bulk-micromachining on wafer-scale. This array is used to demonstrate the feasibility of a low-cost thermal imager. The imager operates in ambient air, without thermal stabilization or cooling. The thermoelectric sensor principle allows one to measure de radiation signals even without a radiation chopper. Each pixel contains an integrated heater, which allows calibration and self-testing of the imager. Addressing circuitry for the thermopiles and the heaters as well as a low-noise amplifier are integrated with the array on a single chip with a size of 5.5 x 6.2 mm. The imager achieves a temperature resolution of 530 mK with a low-cost polyethylene Fresnel lens. This performance allows application in presence detection, remote temperature measurement, and building control.
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