Electromigration subjected to Joule heating under pulsed DC stress

This article reports an electromigration-lifetime model that incorporates the effect of Joule heating under pulsed DC condition. This mediati-time-to-failure model accounts for applied current density, duty factor, frequency, thermal time constant, and interconnect geometry. The model predictions reported in this work agree very well with numerical simulation and experimental data over a wide range of current densities and frequencies. (C) 2001 Elsevier Science Ltd. All rights reserved.