Journal
MATERIALS LETTERS
Volume 53, Issue 4-5, Pages 333-338Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/S0167-577X(01)00503-1
Keywords
Sn-Pb eutectic; copper nanopowders; composite solder; microstructure; microhardness
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This paper presents the microstructure and hardness of composite solders obtained by the addition of nanopowders of copper to a conventional solder. Copper powders-reinforced lead (Pb)-tin (Sn) composite solders were prepared by thoroughly blending nano-sized copper powders (average powder particle size 100 nm) with a powder of a eutectic solder and using a water-soluble flux. The blended solder paste was melted and allowed to re-solidify in a crucible placed on a hot plate and maintained at a constant temperature. Optical microscopy observations revealed the as-solidified microstructure of the composite solder to be altered by the addition of nanopowders to the eutectic Sn-Pb solder. The copper powders precipitated as intermetallic compounds that were non-uniformly distributed through the microstructure. Microhardness measurements revealed a 30-40% increase in hardness of the composite solder over the conventional unreinforced eutectic counterpart. (C) 2002 Published by Elsevier Science B.V.
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