Journal
INFRARED PHYSICS & TECHNOLOGY
Volume 43, Issue 3-5, Pages 239-243Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/S1350-4495(02)00146-9
Keywords
infrared focal-plane-array; HgCdTe-technology; HgCdTe-FPA reliability; multichip-modules; crosstalk
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For high performance IR imaging and seeker systems AIM has established a high yield and reproducible HgCdTe detector technology. For continuous improvement of detector performance, yield and reliability, key processes have been optimized and new approaches have been developed. By a superior CdZnTe Bridgman growth process, dislocation densities <1 X 10(5) cm(-2) in substrate and epitaxial layer are achieved for all substrates, ensuring high performance focal-plane-arrays, particularly for lambda(CO) = 11.5 mum arrays. A new guard ring approach for planar diodes, created by a n(+)-region in pixel spacing area reduces pixel crosstalk and improves modulation transfer function. For long linear arrays, a multichip-module-technique has been developed, which meets the demands for high temperature-cycle-reliability. In addition, a cycle-to-failure model has been established by cooldown tests on AIM-FPA's to predict cycle-to-failure at existing FPA approach or maximum allowable strain at demanded cycles-to-failure specification. (C) 2002 Elsevier Science B.V. All rights reserved.
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