Interface effects for Cu, CuO, and Cu2O deposited on SiO2 and ZrO2.: XPS determination of the valence state of copper in Cu/SiO2 and Cu/ZrO2 catalysts

Copper and copper oxides (Cu2O and CuO) have been deposited by evaporation of copper and subsequent oxidizing treatments, on the surface of flat SiO2 and ZrO2 substrates. Large variations of several eVs have been found in the values of the Cu 2P(3/2) binding energy (BE) and Auger parameter (alpha') of copper as a function of the amount of deposited metallic copper or copper oxides. The magnitude of the changes was also dependent on the type of support upon which the experiment was carried out. These changes have been attributed to modifications in the factors contributing to the initial and final state effects of the process, according to the dispersion degree and the nature of the interactions between the copper oxide moieties and the support. All of these changes can be systematized with the help of chemical state plots. Experiments carried out with real catalysts stress the need of such plots, which summarize the results obtained with the model systems, for a proper characterization of the supported oxide phases in this kind of real materials.