Non-destructive characterisation of porous low-k dielectric films

Characterization of pore structure is needed to develop and optimize low-k dielectric films and processes. Advanced non-destructive methods, such as ellipsometric porosimetry, small-angle neutron and X-ray scattering combined with specular X-ray reflectivity and positron annihilation lifetime spectroscopy have recently been developed for this purpose. In this paper, the results of comparative analysis of different instrumentations are presented. Fundamentals and applications of the ellipsometric porosimetry are analyzed in more detail. (C) 2002 Elsevier Science B.V. All rights reserved.