Obtaining of IB group metal films by novel electroless deposition method

The electroless deposition processes of copper, silver and gold using cobalt(II) complexes with organic amines as reducing agents were studied. The autocatalytic copper deposition was observed in propylenediamine (1,2-diaminopropane) solutions at pH over 5, the metal deposition rate reaching 4 mum/h at 20degreesC and 5 mum/h at 50degreesC. For electroless silver plating solutions, the possibility to replace the largest part of ammonia in the earlier developed solution by glycine was demonstrated, and the new silver plating solution containing trimethylendiamine (TMDA) was developed (plating rate up to 3 mum/h). The electroless gold deposition with film formation rate up to 1 mum/h was observed in TMDA solutions. The coatings obtained are compact and bright, and it is possible to regenerate the reducing agent - cobalt(II) complex. (C) 2002 Editions scientifiques et medicales Elsevier SAS. All rights reserved.