Journal
POLYMERS FOR ADVANCED TECHNOLOGIES
Volume 14, Issue 2, Pages 147-156Publisher
WILEY
DOI: 10.1002/pat.343
Keywords
bismaleimide; epoxy; thermosets; blends; thermal properties
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Epoxy resins modified by an organosoluble phosphorus-containing bismaleimide (3,3'-bis(maleimidophenyl) phenylphosphine oxide, BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212degreesC, thermal stability at temperatures over 350degreesC, and excellent flame retardancy with Limited oxygen index (LOT) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright (C) 2003 John Wiley Sons, Ltd.
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