Journal
ASIAN JOURNAL OF CHEMISTRY
Volume 25, Issue 7, Pages 3679-3681Publisher
ASIAN JOURNAL OF CHEMISTRY
DOI: 10.14233/ajchem.2013.13714
Keywords
Electroless copper plating; Sodium hypophosphite; Glycine; Rate equation
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Funding
- National Natural Science Foundation of China [50975058]
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In this work, the effect of Cu2+, Ni2+ glycine, Sodium hypophosphite, pH value and temperature on the deposition velocity was studied by weight method. In addition, the deposition rate equation was calculated in the system using glycine as the complexing agent and sodium hypophosphite as the reducing agent.
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