Journal
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume 51, Issue 4, Pages 1067-1075Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2003.809674
Keywords
on-chip solenoid inductor; plastic deformation magnetic assembly (PDMA); three-dimensional (3-D) assembly; vertical spiral inductor
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On-chip inductors are critical for enabling portables power-efficient wireless communication systems. Existing on-chip spiral inductors based on conventional planar integrated-circuit fabrication technology suffer from substrate loss and parasitics, and have relatively large footprints. In this paper, we discuss the development of on-chip three-dimensional (3-D) inductors-a vertical spiral inductor and a solenoid inductor-by using a 3-D assembly process called plastic deformation magnetic assembly. Prototype vertical spiral inductors and solenoid inductors have been fabricated and tested. Experimental results show that the vertical spiral inductors can achieve better performance and a smaller footprint than the in-plane ones.
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