Journal
ACTA MATERIALIA
Volume 51, Issue 7, Pages 2067-2078Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S1359-6454(03)00006-5
Keywords
thin films; tensile testing; Hall-Petch; grain boundary strengthening; annealing
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The room temperature mechanical behavior of free-standing, coarse-grained gold films (grain size greater than 1.5 mum) was investigated by uniaxial tensile testing. Use of different deposition conditions resulted in films with a variety of microstructures. In addition, some of the free-standing films were also subjected to high temperature anneals to further alter their microstructures. With the exception of low ductility, the mechanical behavior of the films was generally consistent with what would be expected from large-scale gold specimens having similar grain size. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
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