4.7 Article

Ti-added alumina dispersion-strengthened Cu alloy fabricated by oxidation

Journal

JOURNAL OF ALLOYS AND COMPOUNDS
Volume 622, Issue -, Pages 384-387

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2014.10.031

Keywords

Alumina; Dispersion strengthening; High conductivity; High strength; Surface oxidation

Funding

  1. National Research Foundation of Korea (NRF) - Korean government (MSIP) [2011-0030058]
  2. Global Frontier R&D Program of the Global Frontier Hybrid Interface Materials R&D Center - Ministry of Science, ICT, and Future Planning [2013M3A6B1078874]
  3. National Research Foundation of Korea [31Z20130012978, 2013M3A6B1078874, 2011-0030058] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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Two types of alumina dispersion-strengthened Cu alloy were fabricated by surface oxidation reaction by the aging of Cu-0.31 wt%Al and Cu-0.28 wt%Al-0.07 wt%Ti alloys in air. After heat treatment at 980 degrees C for 1 h in air, a 0.2 mm-thick alumina-dispersed plate could be prepared. The alumina-dispersed alloy with Ti addition showed higher values of conductivity, hardness, and tensile strength than the alloy without Ti. (C) 2014 Elsevier B.V. All rights reserved.

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