4.5 Article

Analysis of physical properties of III-nitride thin films by nanoindentation

Journal

JOURNAL OF ELECTRONIC MATERIALS
Volume 32, Issue 6, Pages 496-500

Publisher

SPRINGER
DOI: 10.1007/s11664-003-0132-0

Keywords

nanoindentation; Young's modulus; hardness; maximum shear stress; plastic energy; elastic recovery; contact stress-strain

Ask authors/readers for more resources

The thin films of undoped GaN, GaN:Si, and Al0.12Ga0.88N on sapphire (0001) substrate using nanoindentation are investigated. The Young's modulus, hardness, and plastic energy of the films were calculated from the loading-unloading curve. The true hardness, maximum shear stress, and degree of elastic recovery are then deduced from the preceding calculated data. In addition, the loading-unloading curve clearly shows the pop-in phenomena, which can be attributed to the dislocation nucleation. To better understand the factors affecting the quality of films produced, the stress-strain relationship, which is able to reflect the quality of the fabricated films, is also analyzed using nanoindentation.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.5
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available