Journal
JOURNAL OF ADHESION
Volume 79, Issue 6, Pages 609-616Publisher
TAYLOR & FRANCIS LTD
DOI: 10.1080/00218460309540
Keywords
epoxy; Diels-Alder; diamine; adhesion; thermally reversible; thermally removable
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Thermally reversible adhesives are prepared through the reaction of aliphatic diamines and a diepoxy compound containing two Diels-Alder adducts. The diepoxy compound is formed via the Diels-Alder reaction between two epoxy-containing furans and a bismaleimide. The adhesive displays a T-g of -40degreesC and a constant shear modulus up to approximately 90degreesC. At temperatures exceeding 90degreesC the retro Diels-Alder reaction occurs, which leads to a significant loss in modulus. The loss of modulus is reversible with temperature. A thermally reversible adhesive is proposed based upon the loss of modulus at an elevated temperature, i.e., adhesives bonds are easily broken at elevated temperature where the modulus is low.
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