Journal
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
Volume 12, Issue 4, Pages 383-389Publisher
SPRINGER
DOI: 10.1361/105994903770342890
Keywords
active filler; active soldering; air; copper; interface; ITO; Sn3.5Ag4Ti(Ce, Ga)
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Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 degreesC in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investigated. Electron probe microanalyzer (EPMA) analyses reveal that the element oxygen distributes uniformly within the solder matrix after soldering, while Ti segregates effectively at the ITO/solder and Cu/solder interfaces at such a low temperature, giving satisfactory joining results of Cu/Cu, ITO/ITO, and ITO/Cu in air.
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