☆
4.1
Article
A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology
JOURNAL OF ELECTRONIC PACKAGING (2003)
Rate this paper
The primary rating indicates the level of overall quality for the paper. Secondary ratings independently reflect strengths or weaknesses of the paper.
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started