Journal
JOURNAL OF APPLIED POLYMER SCIENCE
Volume 89, Issue 14, Pages 3913-3917Publisher
JOHN WILEY & SONS INC
DOI: 10.1002/app.12618
Keywords
polymerization of monomer reactant type polyimide; aluminum nitride; thermal conductivity; dielectric properties
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A new polyimide composite was developed relying on the concept of in situ polymerization of monomer reactants polyimide. High thermal conductive, low dielectric constant and dielectric loss, and thermal-stable composites were successfully demonstrated by incorporating aluminum nitride powder into the polyimide. The weight percent of aluminum nitride was up to 80%. The thermal and dielectric properties follow the classic composite theories. (C) 2003 Wiley Periodicals, Inc.
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