Polyimides reinforced with the sol-gel derived organosilicon nanophase as low dielectric permittivity materials

Polyimide (PI) nanocomposites prepared by the in situ generation of crosslinked organosilicon nanophase (ON) through the sol-gel process were characterized by densities, thermally stimulated depolarization currents and dielectric relaxation spectroscopy. Both a looser molecular packing of PI chain fragments adjacent to the ON and a loose inner structure of the spatial aggregates of ON were assumed to be responsible for a non-additive decrease of the experimental values of dielectric permittivity for the nanocomposites. The pattern of composition dependence of the apparent dielectric permittivity of the ON suggested a probability of a morphological change around the composition PAAS/MTS = 100/16 (presumably, a sort of percolation transition from small-size, individual clusters into large-size, infinite clusters). Thus, PI reinforced with the sol-gel derived nanophase may have a reasonably good potential as low dielectric permittivity materials. Copyright (C) 2004 John Wiley Sons, Ltd.