Journal
ADVANCED MATERIALS
Volume 16, Issue 6, Pages 560-+Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.200306159
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A low-temperature, low-pressure polymer bonding technique for three-dimensional assembly of microstructures (see Figure; scale bar 5 mum) based on carbon dioxide (CO2)enhanced chain entanglement near the polymer surfaces is presented. The environmentally benign utilization of supercritical CO2 offers scope for the production of polymer-based biomedical applications and devices.
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