4.5 Article Proceedings Paper

Corrosion in high-temperature and supercritical water and aqueous solutions: a review

Journal

JOURNAL OF SUPERCRITICAL FLUIDS
Volume 29, Issue 1-2, Pages 1-29

Publisher

ELSEVIER
DOI: 10.1016/S0896-8446(03)00031-7

Keywords

corrosion; high-temperature water; supercritical water; supercritical water oxidation; density; ionic product

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The aim of the present article is to review some of the common corrosion phenomena and describe the predominant corrosion mechanisms in high-temperature and supercritical water. Corrosion in aqueous systems up to supercritical temperatures is determined by several solution-dependent and material-dependent factors. Solution-depending factors are the density, the temperature, the pH value, and the electrochemical potential of the solution, and the aggressiveness of the attacking anions. Material-dependent parameters include alloy composition, surface condition, material purity, and heat treatment. Corrosion phenomena that are observed include intergranular corrosion, pitting, general corrosion, and stress corrosion cracking. The solubility and dissociation of both attacking species and corrosion products play the most important role for corrosion in high-temperature water. Both solubility and dissociation processes are strongly influenced by the density, or the ionic product, respectively, of the solvent. High values of both parameters favor ionic reactions, and thus, accelerate electrochemical forms of corrosion. At low densities, water behaves like a non-polar solvent, and thus, ions associate. In these cases, the concentation of e.g. aggressive HI drops down and thus, solutions containing species such as HCl become neutral and thus less aggressive. Further, corrosion products plug the surface and material loss stops. Materials parameters have influence especially on the initiation of corrosion. In the present article, these factors are linked with the physical and chemical properties of high-temperature and supercritical water. An outlook is also given for future research needs. (C) 2003 Published by Elsevier B.V.

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