4.3 Article

Carboxylic acid terminated monolayer formation on crystalline silicon and silicon nitride surfaces. A surface coverage determination with a fluorescent probe in solution

Journal

JOURNAL OF MATERIALS CHEMISTRY
Volume 14, Issue 9, Pages 1461-1468

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/b312273e

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Carboxylic acid terminated (-COOH) monolayers (ML) have been covalently anchored on the surface (S) of crystalline silicon (Si) and silicon nitride (Si3N4) by using wet-chemistry methods. Their concentration has been determined adopting a stepwise procedure with a fluorescent probe in solution. First, 7-amino-4-methylcoumarin (H2N-C10H7O2, AMC) is covalently bonded to the monolayer on the surface through an amidation reaction forming an amide-terminated surface monolayer, S-(CH2)(n)-CO-NH-C10H7O2, then the surface is intensely washed in order to remove any physisorbed species, finally AMC is detached from the surface via hydrolysis of the -CO-NH- bond and quantified by a fluorescence analysis in water solution. The yields of both the amidation and hydrolysis reactions have been evaluated. By this method, submonolayers less than or equal to0.1 +/- 0.03 ML can be determined. It has been possible to evaluate the different extent of surface functionalization changing the substrate between Si and Si3N4 and for Si changing the monolayer fort-nation reaction: heat- (Delta) or light- (hv) promoted or via cathodic electrografting (CEG). It came out that submonolayers are formed in any case, Si3N4 is functionalized to a larger extent than Si on heating (0,52 vs. 0.15 ML) and Si is best functionalized via cathodic electrografting: Delta, 0.15; h), 0.20; CEG, 0.44 ML. Surface topography of some monolayers on Si and Si3N4 substrates was investigated by Atomic Force Microscopy (AFM). On clean Si, AFM showed topographical variations of 0.3-0.4 nm while for the clean Si3N4 the corrugation was around 3-4 nm. After functionalization the two surfaces were uniformly covered and the corrugation increased in both samples with a corrugation in topography of 1-2 am for Si and 5-6 nm for Si3N4.

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