Journal
ORTHOPADE
Volume 33, Issue 6, Pages 685-+Publisher
SPRINGER
DOI: 10.1007/s00132-004-0658-8
Keywords
ulnar wrist pain; ulnocarpal abutment syndrome; arthroscopic wafer procedure; TFCC-tears; results
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The wafer procedure is a technique involving the partial resection of the distal ulna for the treatment of patients with symptomatic tears of the TFCC, for ulnar abutment syndrome or both. The TFCC-tears are classified as Palmer type 2. The wafer procedure can be performed as an open procedure or arthroscopically. It is an alternative to a shortening osteotomy of the ulna and decompresses the ulnocarpal joint. In ten cases with long-term follow-up, the preferability of the arthroscopic method is demonstrated: a minimally invasive technique, optimal assessment of all lesions, maximum protection of all uninjured structures in comparison to the open method, single stage procedure,and low complication rate. The long-term results are predominantly positive,so that the arthroscopic wafer procedure should be performed more often than it is today.
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