Journal
APPLIED THERMAL ENGINEERING
Volume 29, Issue 11-12, Pages 2391-2395Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2008.12.037
Keywords
Microelectronic device; Thermal loading; Optimization
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The aim of this paper is to provide a methodical approach for architectural optimization of power microelectronic devices. Because critical parameters of electronic devices are linked with reliability, architectural optimization, selection of the geometrical parameters of device and optimization of these parameters by iteration method associated by numerical analysis of reliability have to be achieved. In this way, this paper discusses about a methodical and numerical approach for the optimization of reliability in electronic devices, in particular the influence of geometrical parameters on the device reliability. (C) 2008 Elsevier Ltd. All rights reserved.
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