Journal
APPLIED THERMAL ENGINEERING
Volume 28, Issue 8-9, Pages 1047-1057Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2007.06.010
Keywords
phase change materials; heat sink; electronics cooling; thermal management
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Use of a phase change material (PCM)-based heat sink in transient thermal management of plastic quad flat package (QFP) electronic devices was investigated experimentally and numerically. Results show that increased power inputs enhance the melting rate as well as the thermal performance of the PCM-based heat sinks until the PCM is fully melted. A three-dimensional computational fluid dynamics model was proposed to simulate the problem and demonstrated good agreement with experimental data. Results indicate the potential for PCM-based heat sinks for use in intermittent-use devices. (C) 2007 Elsevier Ltd. All rights reserved.
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