Journal
APPLIED SURFACE SCIENCE
Volume 290, Issue -, Pages 240-245Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2013.11.057
Keywords
Cu nanoparticle; Ink; Conductive pattern; Oxidation; Sintering
Categories
Funding
- National Nature Science Foundation of China [51071108]
- Tianjin Key subject for Materials Physics and Chemistry
- Key Laboratory of Display Materials & Photoelectric Devices
- Tianjin Key Lab for Photoelectric Materials Devices
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In this study, pure Cu nanoparticles (NPs) have been successfully synthesized and the Cu nano-ink was prepared for direct writing on photo paper using a roller pen. The tri-sodium citrate was used as initial reducing-cum-surfactant agent followed by hydrazine as a second massive reducing agent and cetyltrimethylammonium bromide (CTAB) as extra surfactant agent. From the XRD, TEM, and HR-TEM analyses, the synthesized particles are confirmed to be Cu in spherical shape with sizes range of 2.5 +/- 1.0 nm. By analyzing the FT-IR spectroscopy and TGA curves, it was found that the obtained particles capped with tri-sodium citrate and CTAB layers are stable to oxidation up to the temperature 228 degrees C. The reduced size and enhanced air-stability of the Cu NPs result in an improved particle density upon sintering, which is mainly responsible for the increased conductivity of the Cu patterns. The resistivity of Cu patterns sintered in Ar at 160 degrees C for 2 h is 7.2 +/- 0.6 mu Omega cm, which is 4.40 times the bulk Cu resistivity. The drawn Cu lines exhibited excellent integrity and good conductivity, which were experimentally tested. Moreover, a Cu electrode and a sample RFID antenna were successfully made. (C) 2013 Elsevier B. V. All rights reserved.
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