4.7 Article

Phytic acid adsorption on the copper surface: Observation of electrochemistry and Raman spectroscopy

Journal

APPLIED SURFACE SCIENCE
Volume 276, Issue -, Pages 167-173

Publisher

ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2013.03.061

Keywords

Copper; Phytic acid; Raman; EIS; Electrochemical polarization

Funding

  1. National Natural Science Foundation of China [21073121]
  2. Key Laboratory of Resource Chemistry of Ministry of Education

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The adsorption of phytic acid (PA) on copper was investigated using electrochemical impedance spectroscopy (EIS), electrochemical polarization measurement and surface-enhanced Raman scattering (SERS) spectroscopy. Electrochemical results indicated that inhibition efficiency of PA film for copper from corrosion in 3 wt% NaCl solution was beyond 80% at an optimum self-assembly concentration of 0.1 mM for 6 h. Electrochemical polarization indicated that PA functioned as a cathodic inhibitor. In addition, Raman studies showed that PA adsorbed on the copper surface formed via P-O groups. Finally, the value of Delta G(ads) (-39.96 kJ mol(-1)) was close to -40 kJ mol(-1), suggesting that the adsorption of PA on the copper surface was the chemical adsorption. (C) 2013 Elsevier B. V. All rights reserved.

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