Layer-by-layer deposition of Ti-4,4′-oxydianiline hybrid thin films

Features of the two thin-film techniques, atomic layer deposition (ALD) and molecular layer deposition (MLD), are combined to build up a stable novel inorganic-organic hybrid material of the (-Ti-N-C(6)H(4)-O-C(6)H(4)-N-)(n) type, deposited from successive pulses of TiCl(4) and 4,4'-oxydianiline precursors. Depositions in the temperature range of 160-230 degrees C resulted in unstable films, while the films obtained in the temperature range of 250-490 degrees C were found stable in atmospheric air. The growth rate increased with increasing temperature, from 0.3 angstrom per cycle at 160 degrees C to 1.1 angstrom per cycle at 490 degrees C. (C) 2011 Elsevier B.V. All rights reserved.