Journal
JOURNAL OF CRYSTAL GROWTH
Volume 268, Issue 1-2, Pages 24-29Publisher
ELSEVIER
DOI: 10.1016/j.jcrysgro.2004.04.102
Keywords
buffer layer; line defects; X-ray diffraction; metalorganic chemical vapor deposition; gallium compounds; nitrides
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The influence of low-temperature AlN buffer layer thickness on GaN epilayer was investigated by triple-axis X-ray diffraction (XRD) and photoluminescence measurements. A method was proposed to measure the screw and edge dislocation densities by XRD. It was found that the buffer layer thickness was a key parameter to affect the quality of GaN epilayer and an appropriate thickness resulted in the best structural and optical properties except the lateral grain size. After the thickness exceeding the appropriate value, the compressive stress in the epilayer decreased as the thickness increased, which led to the redshift of the near-band edge luminescence. The experimental results showed the buffer layer thickness had more influence on edge dislocation than screw type and the former was perhaps the main source of the yellow band. (C) 2004 Elsevier B.V. All rights reserved.
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