Journal
APPLIED SURFACE SCIENCE
Volume 256, Issue 20, Pages 5998-6002Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2010.03.108
Keywords
Substrate effect; Nanoindentation; Finite element method; Dimensionless analysis
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Funding
- NNSF of China [10825209, 50872117]
- Changjiang Scholar Incentive Program [[2009]17]
- Hunan Provincial Innovation Foundation [CX2009B131]
- Hunan's Prestigious Fu-rong Scholar Award [[2007]362]
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A method to evaluate the substrate effect quantitatively in film indentation is proposed. For the thin film deposited on the substrate, the power function relationship is used to describe the loading curve of the film indentation behavior. The loading curve exponent of the power function which is the fitting parameter can reflect the substrate effect quantitatively. The finite element method is used to simulate the nanoindentation process of the film/substrate system. The loading curve exponent can be obtained from the simulation results. A substrate effect factor based on the loading curve exponent is defined to characterize the effect of the substrate on film indentation. Meanwhile, the dimensionless function of the loading curve exponent related with the material properties and indentation depth is obtained. The results can be helpful to the measurement of the mechanical properties of thin films by means of nanoindentation. (C) 2010 Elsevier B.V. All rights reserved.
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