Journal
APPLIED SURFACE SCIENCE
Volume 255, Issue 6, Pages 3752-3758Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2008.10.025
Keywords
Lithography patterning; Silicon nanowires; Electroless metal deposition; Etch rate; Ratio of length-to-width
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Funding
- National Natural Science Foundation of China [60672002]
- Shanghai Pujiang Project [06PJ14037]
- Shanghai Leading Academic Discipline Project [B411]
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In this paper, the selective growth of silicon nanowires (SiNWs) was studied. With the aid of photolithography, the vertically aligned silicon nanowires were selectively formed on the patterned substrates via an electroless metal deposition (EMD) method under normal conditions (room temperature, 1 atm). Low-pressure chemical vapor deposition (LPCVD) silicon nitride was used as the masking layer for SiNWs preparation. The scanning electron microscope was used to examine the etching results. Both the patterned and the unpatterned silicon substrates were used for study. The results indicated that the growth rates of the SiNWs upon the patterned and the unpatterned substrates are different. For the patterned substrates, the growth rate of SiNWs is dependent upon the pattern shape. The influence of length-to-width ratio for the rectangular-shaped patterns was studied. It is concluded that by designing the proper length-to-width ratio, the nanowires with different lengths can be fabricated simultaneously on the same substrate. (C) 2008 Elsevier B.V. All rights reserved.
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