Journal
APPLIED PHYSICS LETTERS
Volume 104, Issue 6, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.4864406
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Funding
- European Commission
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This letter reports the use of the Laser-Induced Forward Transfer (LIFT) technique for the fabrication of indium micro-bumps for the flip-chip (FC) bonding of single vertical-cavity surface-emitting laser chips. The FC bonded chips were electrically and optically characterized, and the successful functioning of the devices post-bonding is demonstrated. The die shear and life-time tests carried out on the bonded chips confirmed the mechanical reliability of the LIFT-assisted FC bonded assemblies. (C) 2014 AIP Publishing LLC.
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