Journal
APPLIED PHYSICS LETTERS
Volume 102, Issue 25, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.4812653
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Funding
- National Science Foundation of China [61025002]
- National 973-project of China [2009CB623302]
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A polymer based composite was prepared by using modified aluminum fibers and aluminum nanoparticles as fillers in polyimide matrix that resulted in the high thermal conductivity and low relative permittivity. It was found that silica coated aluminum fibers with the multilayer coating structures can significantly reduce the relative permittivity (about 19.6 at 1 MHz) of the composite while keeping lower dielectric loss (0.024 at 1 MHz). The thermal conductivity of composites was significantly increased to 15.2 W/m K. This work shows a useful way to choose proper modifier fillers to improve the composite properties for electronic packaging composite materials. (C) 2013 AIP Publishing LLC.
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