Journal
APPLIED PHYSICS LETTERS
Volume 103, Issue 5, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.4817511
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- Bureau of Energy, Ministry of Economic Affairs, Taiwan, R.O.C.
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This study demonstrates the feasibility of producing a tantalum nitride (TaN) thin film as a diffusion barrier and buffer layer for p-type bismuth telluride [(Bi,Sb)(2)Te-3] thermoelectric devices. A network of TaN with nitrogen (N) incorporation is structurally more stable on (Bi,Sb)(2)Te-3 than the conventional Ni diffusion barrier because of less inter-diffusion and a greater likelihood of stoichiometry in the TaN/(Bi,Sb)(2)Te-3 interface. The atomic inter-diffusion between the barrier layers and (Bi, Sb)(2)Te-3 was evaluated in terms of interface adhesion energy using nanoscratching, and proved with first-principles calculations. (C) 2013 AIP Publishing LLC.
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