Journal
JOM
Volume 56, Issue 10, Pages 32-34Publisher
SPRINGER
DOI: 10.1007/s11837-004-0286-0
Keywords
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Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost.
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