4.6 Article

Oxygen migration induced resistive switching effect and its thermal stability in W/TaOx/Pt structure

Journal

APPLIED PHYSICS LETTERS
Volume 100, Issue 25, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/1.4730601

Keywords

-

Funding

  1. National Hi-tech (R&D) project of China [2009AA034001]
  2. National Natural Science foundation of China [50772055, 50871060]
  3. National Basic Research Program of China [2010CB832905]

Ask authors/readers for more resources

We investigate the resistive switching mechanism and the thermal stability in room temperature-fabricated nonvolatile memory consisting of W/TaOx/Pt. By comparing the chemical bonding of Ta 4f between high and low resistance states at W/TaOx and TaOx/Pt interfaces, the switching mechanism is confirmed to be dominated by the oxygen ions drift in the TaOx film. Besides, it is demonstrated that the resistive switching behavior is still dynamic and the resistance can be maintained at temperature as high as 510 K. We found that the resistive switching behavior of TaOx film exhibits little degradation even after annealed at 1273 K. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4730601]

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.6
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available