Journal
JOURNAL OF SOLID STATE CHEMISTRY
Volume 177, Issue 10, Pages 3743-3747Publisher
ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jssc.2004.07.012
Keywords
nanoparticle; discharge; preparation; self-assembly; copper; surfactant; colloid
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Cu nanoparticles with a mean diameter of 10-15 nm were prepared and self-assembled via discharge of bulk copper rods in a cetyltrimethylammonium bromide (CTAB)/ascorbic acid solution. Ascorbic acid was used as a protective agent to prevent the nascent Cu nanoparticles from oxidation in the solution;, otherwise spindle-like Cu2O/CuO structures, with a lateral dimension of 30-50nm and length of up to 100nm, were formed in pure deionized water. The surfactant CTAB had a critical influence on self-assembly of spherical Cu nanostructures (with diameter of 700 nm-1mum). Such a low-temperature and non-vacuum method, exhibiting the characters of both physical and chemical processes, provides a versatile choice for economical preparation and assembly of various metal nanostructures. (C) 2004 Elsevier Inc. All rights reserved.
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