Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 55, Issue 1, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.7567/JJAP.55.016701
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We evaluated room-temperature bonding characteristics of electroplated Au surfaces smoothed by the lift-off and imprint methods. As a result, we found that smoothed surfaces enable strong bonding; on the other hand, electroplated rough surfaces result in very weak bonding. In transmission electron microscopy observations, no delamination was observed at the bonding interface bonded at room temperature using a smooth surface prepared by the lift-off method. Moreover, the hermeticity of the bonding interface prepared using smoothed surfaces was evaluated using diaphragm structures. As a result, we confirmed that good hermetic sealing was achieved using the electroplated Au surface smoothed by the liftoff method. (C) 2016 The Japan Society of Applied Physics
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