Journal
APPLIED PHYSICS LETTERS
Volume 96, Issue 17, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.3409475
Keywords
bending; elemental semiconductors; invertors; logic gates; silicon; thin film transistors
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Funding
- Ministry of Knowledge Economy of Korea [2008-F024-01]
- Ministry of Education, Science and Technology [331-2008-1-D00265, 2009-0083540]
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This letter presents a method to fabricate single-crystal silicon wires from (100) wafer and print them onto thin plastic substrates for high-performance, mechanically flexible, thin-film transistors by dry transfer printing. Electrical measurements indicate excellent performance, with a per ribbon mobility of 580 cm(2)/V s, subthreshold voltage of 100 mV/dec and on/off ratios >10(7). The inverter shows good performance and voltage gains of similar to 2.5 at 3 V supply voltage. In addition, these devices revealed stable performance at bending configuration, an important feature essential for flexible electronic systems.
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