Journal
APPLIED PHYSICS LETTERS
Volume 93, Issue 2, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.2949081
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The electrical performance of SiC-based microelectronic devices is strongly affected by the densities of interfacial traps introduced by the chemical and structural changes at the SiO2/SiC interface during processing. We analyzed the structure and chemistry of this interface for the thermally grown SiO2/4H-SiC heterostructure using high-resolution transmission electron microscopy (TEM), Z-contrast scanning TEM, and spatially resolved electron energy-loss spectroscopy. The analyses revealed the presence of distinct layers, several nanometers thick, on each side of the interface; additionally, partial amorphization of the top SiC surface was observed. These interfacial layers were attributed to the formation of a ternary Si-C-O phase during thermal oxidation. (C) 2008 American Institute of Physics.
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