Journal
PHYSICAL REVIEW LETTERS
Volume 93, Issue 24, Pages -Publisher
AMERICAN PHYSICAL SOC
DOI: 10.1103/PhysRevLett.93.245503
Keywords
-
Categories
Ask authors/readers for more resources
Molecular dynamics simulations in three-dimensional copper are performed to quantify the void coalescence process leading to fracture. The correlated growth of the voids during their linking is investigated both in terms of the onset of coalescence and the ensuing dynamical interactions through the rate of reduction of the distance between the voids and the directional growth of the voids. The critical intervoid ligament distance marking the onset of coalescence is shown to be approximately one void radius in both measures.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available