Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 387, Issue -, Pages 768-771Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2004.05.049
Keywords
mechanical alloying; ODS copper; ultra-fine-grained material; microstructure; hardening mechanism
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The microstructure of ultra-fine-grained (UFG) oxide-dispersion strengthened (ODS) copper, produced by mechanical alloying at low temperatures (cryomilling) and subsequent hot pressing under protective argon atmosphere of copper powder and 3 vol.% of yttrium and calcium oxides, respectively, was examined by means of high-resolution scanning electron microscopy. Compressive deformation experiments at room temperature yield a substantial increase of the 0.2% yield strength of the UFG ODS copper when compared with pure copper. The very high yield strength (sigma(0.2) = 600 MPa) is the result of a simultaneous occurrence of grain boundary strengthening and particle hardening. The overall yield strength could be best modelled by a linear superposition of the Orowan stress for particle hardening and of the contribution from fine grain strengthening after Hall-Petch. (C) 2004 Elsevier B.V. All rights reserved.
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