Journal
APPLIED PHYSICS LETTERS
Volume 93, Issue 19, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.3007978
Keywords
annealing; atomic layer deposition; capacitance; dielectric thin films; gallium arsenide; hafnium compounds; III-V semiconductors; MOS capacitors; passivation; semiconductor-insulator boundaries; X-ray photoelectron spectra
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Funding
- Applied Materials and National Science Foundation
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Properties of ultrathin HfAlO gate dielectrics on sulfur-passivated p-GaAs were investigated using capacitance-voltage and current-voltage measurement techniques and angle-resolved x-ray photoelectron spectroscopy. By optimizing the individual layer thickness of atomic-layer deposited Al(2)O(3) and HfO(2) and the postdeposition anneal (PDA) conditions, a low equivalent oxide thickness of 1.6 nm, low gate leakage of 2.6x10(-3) A/cm(2) at V(g)=V(fb)-1 V, and excellent frequency dispersion characteristics were obtained. No interfacial As-O bonding and only a small amount of Ga-O bonding were detected after PDA at 500 degrees C. These results reveal a good quality dielectric interface on GaAs without an additional interface passivation layer.
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